SMED 4.0 and TPM Integration for OEE Improvement in Label Printing: A Simulation-Based Validation Study

Del Pilar Munãnte R.; Maradiegue-Tuesta F.; Pinzón-Hoyos F. · Proceedings of the International Conference on Mechanical and Intelligent Manufacturing Technologies, ICMIMT (2026) · DOI: 10.1109/icmimt69639.2026.11642851

Resumen

The printing industry faces efficiency challenges due to long setup times, unplanned downtime, and a lack of standardized parameters, resulting in low Overall Equipment Effectiveness (OEE). This study proposes an integrated improvement model that combines the pillars of Total Productive Maintenance (TPM) - specifically autonomous and planned maintenance - with the Single-Minute Exchange of Die (SMED) methodology and Industry 4.0 tools (IoT sensors, OPC-UA protocol, and predictive analytics), applied to a label printing company. The model was evaluated through discrete-event simulation using Rockwell Arena software. The simulation results show a 45% reduction in setup times, a 30% decrease in unplanned downtime, and an OEE improvement from 66.85% to 82% (16 percentage points), with a projected return on investment (ROI) within eight months. The proposed framework provides a replicable approach for small and medium-sized enterprises (SMEs) in the graphic sector, enabling improved machine availability and competitiveness through Lean-Industry 4.0 integration.

Instituciones: Universidad Peruana de Ciencias Aplicadas