Increasing OEE in the Flexible Packaging Industry: Integrating Predictive Maintenance, IoT, SMED and Centerline for Smart Manufacturing

Alvarado-Vasquez R.; Espinoza-Gonzales D.; Maradiegue-Tuesta F.; Pinzón-Hoyos F. · ETCM 2025 - 9th Ecuador Technical Chapters Meeting (2025) · DOI: 10.1109/etcm67548.2025.11304485

Resumen

The Peruvian flexible packaging industry is a strategic pillar for food, beverage, and hygiene sectors. It contributes 7.4% to the manufacturing Gross Domestic Product (GDP). However, its competitiveness is limited by operational deficiencies linked to low Overall Equipment Effectiveness (OEE). In the studied plant, OEE reached only 69.47%, compared to the 85% standard. This gap caused losses equivalent to 3.08% of annual revenue due to recurrent mechanical misalignments, accelerated component wear, overload failures, and setup times of up to 45 minutes. To address these issues, the research proposes an integrated model with two pillars. The first is Predictive Maintenance (PdM) supported by Internet of Things (IoT) technologies, where vibration, temperature, and pressure sensors with more than 95% accuracy enable early failure detection. The second is the Single Minute Exchange of Die (SMED) methodology combined with Centerline, which reduces process variability and ensures stable operation. Validation through As-Is and To-Be scenarios and indicators shows significant improvements. OEE increases by 15.53 percentage points. Mean Time Between Failures (MTBF) rises from 12 to 20 hours. Mean Time To Repair (MTTR) decreases from 4.2 to 2.5 hours. Setup time is reduced from 45 to 20 minutes. The findings demonstrate that integrating IoT, PdM, SMED, and Centerline is a technically and economically feasible strategy that strengthens sustainability and competitiveness in the Peruvian flexible packaging industry.

Instituciones: Universidad Peruana de Ciencias Aplicadas