Advancing sustainability through wood plastic composites: A web of science based bibliometric review and patent trend analysis for a circular economy

Salazar-Fernandez M.C.; Monteiro P.H.R.; Fuentes-Apaza M.M.; Vera-Olvea N.C.; Casado F.L.; Flores-Clavo R. · Next Materials (2026) · DOI: 10.1016/j.nxmate.2026.103136

Resumen

Wood plastic composites (WPCs) have gained increasing attention as materials that integrate polymer matrices with lignocellulosic and agro-industrial residues within circular economy strategies. However, the relationship between scientific production, patent activity, material selection, processing routes and industrial applicability remains insufficiently synthesized. This study presents a WoS based bibliometric review and patent trend analysis of WPC related innovation between 2019 and 2024. A total of 123 scientific publications retrieved from WoS and 182 patent records retrieved from WIPO and Google Patents were analyzed according to residue type, geographical distribution, applicant profile, processing technology and application trends. Wood residues were the most represented material in scientific publications, whereas bamboo fiber dominated the patent dataset, revealing a clear science patent gap in biomass selection. Patent activity was highly concentrated in Asia, particularly China, and was mainly driven by private companies, while universities showed limited participation. The findings indicate that extrusion, injection molding, compression molding, reactive extrusion and additive manufacturing are key processing routes, although their industrial maturity and scalability differ substantially. Major challenges include inconsistent material performance, limited long-term durability evidence, fiber–matrix compatibility, moisture sensitivity and the need to distinguish recyclable, bio-based, biodegradable and waste-derived WPC systems. This review identifies priority areas for future WPC development, including improved interfacial engineering, standardized durability testing, life cycle assessment, patent-family normalization and stronger academia industry collaboration.

Instituciones: Pontificia Universidad Católica del Perú